CVE-2019-10558 in Snapdragon Auto
Summary
by MITRE
While transferring data from APPS to DSP, Out of bound in FastRPC HLOS Driver due to the data buffer which can be controlled by DSP in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCN7605, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SDX24, SDX55, SM6150, SM8150, SM8250, SXR1130, SXR2130
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Analysis
by VulDB Data Team • 01/21/2020
This vulnerability exists within the FastRPC HLOS driver component of Qualcomm's Snapdragon automotive and mobile platform ecosystems where data transfer operations between application processors and digital signal processors create opportunities for out-of-bounds memory access. The flaw specifically manifests when the driver processes data buffers that can be manipulated by the DSP component, creating a potential pathway for unauthorized memory access patterns. The vulnerability affects multiple Snapdragon platform variants including automotive, consumer electronics connectivity, consumer IoT, industrial IoT, mobile, voice and music, and wearable devices across various chipsets such as APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCN7605, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SDX24, SDX55, SM6150, SM8150, SM8250, SXR1130, and SXR2130. The root cause stems from inadequate bounds checking within the FastRPC driver implementation where the system fails to properly validate buffer sizes and memory access parameters during inter-processor communication. This vulnerability falls under CWE-129 which specifically addresses insufficient validation of length of input buffers, and represents a critical security weakness that can be exploited through the ATT&CK technique of privilege escalation via driver manipulation. The operational impact of this vulnerability extends beyond simple memory corruption as it enables potential attackers to execute arbitrary code within the DSP context or manipulate critical system resources. The nature of this flaw allows for potential information disclosure, system instability, and in severe cases complete system compromise. Attackers could leverage this vulnerability to gain elevated privileges, access sensitive data, or disrupt normal device operations through carefully crafted buffer manipulation techniques. The vulnerability is particularly concerning in automotive and industrial applications where system reliability and security are paramount, as it could potentially be exploited to compromise vehicle systems or industrial control mechanisms.
The technical implementation flaw occurs in the FastRPC HLOS driver where data buffer management lacks proper validation mechanisms. When the DSP component sends data to the application processor, the driver processes this information without sufficient bounds checking on the buffer parameters. This creates an opportunity for attackers to craft malicious buffer requests that exceed allocated memory boundaries, leading to memory corruption and potential code execution. The vulnerability is classified as a buffer overflow condition that exists in the inter-processor communication layer, specifically within the FastRPC driver's handling of DSP-controlled data buffers. The attack surface is broad due to the widespread adoption of these Snapdragon platforms across various device categories and the inherent trust model that allows DSP components to communicate directly with system memory. This weakness represents a classic case of insufficient input validation where the driver assumes buffer sizes and access patterns are legitimate without proper verification checks. The vulnerability can be exploited through the standard ATT&CK framework's privilege escalation techniques, where attackers manipulate the DSP component to send malformed buffer requests that trigger the out-of-bounds memory access. The exploitation requires understanding of the FastRPC protocol implementation and the specific memory layout of the affected platforms, making it a sophisticated attack vector that targets the core communication infrastructure between processor components. The security implications extend to potential data breaches, system compromise, and unauthorized access to sensitive automotive or industrial systems that rely on these Snapdragon platforms for their operation.
Mitigation strategies for this vulnerability must address both the immediate driver-level issues and broader system security concerns. Qualcomm has released patches for affected platforms that include enhanced bounds checking mechanisms within the FastRPC HLOS driver to prevent out-of-bounds memory access. System administrators should ensure all affected devices receive the latest firmware updates and security patches to address this vulnerability. The mitigation approach should include implementing proper input validation and buffer boundary checks in all inter-processor communication components. Additionally, system monitoring should be enhanced to detect anomalous buffer access patterns that might indicate exploitation attempts. Organizations using affected Snapdragon platforms should conduct thorough security assessments to identify potential attack vectors and implement additional defensive measures such as memory protection techniques and runtime integrity checks. The vulnerability highlights the importance of secure driver development practices and proper validation of all external inputs, particularly in embedded systems where processor components communicate directly with system memory. Security teams should also consider implementing network segmentation and access controls to limit potential exploitation opportunities, especially in automotive and industrial environments where these platforms are deployed. The recommended remediation includes both immediate patch deployment and long-term architectural improvements to prevent similar vulnerabilities in future implementations, aligning with industry best practices for secure embedded system development and adherence to security standards such as those defined in the NIST Cybersecurity Framework and ISO/IEC 27001 security management standards.