CVE-2020-11227 in Snapdragon Auto

요약

\~에 의해 VulDB • 2026. 06. 20.

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables에서 RTT/TTY 패킷을 파싱할 때 버퍼 크기를 복사 전에 확인하지 않아 발생하는 버퍼 오버플로우(Out of bound write) 취약점

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• 예약하다: 2020. 03. 31.
• 공개: 2021. 03. 17.
• 모더레이션: 수락
• 항목: VDB-171351
• CPE: 준비됨
• CWE: CWE-787 (확인됨)
• CVSS: 9.8 (NVD)
• EPSS: 0.00911
• KEV: 아니요
• 활동: 매우 낮음
• 부문: Agriculture, Chemical, ...

출처

• MITRE: https://www.cve.org/CVERecord?id=CVE-2020-11227
• NVD: https://nvd.nist.gov/vuln/detail/CVE-2020-11227
• CVE Details: https://www.cvedetails.com/cve/CVE-2020-11227/