CVE-2019-2242 in Snapdragon Auto
Tóm tắt
Bởi VulDB • 11/07/2026
Bộ nhớ thiết bị có thể bị hỏng do tràn/underflow bộ đệm. Trong Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables trên các chip APQ8009, APQ8016, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SM6150, SM7150, SXR1130
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