CVE-2016-2063 in Linux
Summary
by MITRE
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
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Analysis
by VulDB Data Team • 09/12/2022
The vulnerability identified as CVE-2016-2063 represents a critical stack-based buffer overflow within the MSM Thermal driver component of the Linux kernel version 3.x series. This flaw exists in the supply_lm_input_write function located in drivers/thermal/supply_lm_core.c, which is part of Qualcomm's contribution to Android development for MSM devices. The vulnerability specifically affects devices where Qualcomm Innovation Center (QuIC) has implemented these kernel components, making it prevalent in numerous Android smartphones and tablets that utilize Qualcomm's MSM processor architectures.
The technical implementation of this vulnerability stems from inadequate input validation within the supply_lm_input_write function, which processes data received through the debugfs interface. When a malicious application attempts to write an excessive amount of data to this interface, the function fails to properly bounds-check the input before copying it into a fixed-size stack buffer. This fundamental flaw allows attackers to overwrite adjacent stack memory locations, potentially leading to arbitrary code execution or system instability. The vulnerability is particularly concerning because it operates within kernel space, where successful exploitation could provide attackers with elevated privileges and complete system compromise.
The operational impact of CVE-2016-2063 extends beyond simple denial of service conditions to potentially enable more severe consequences including system crashes, data corruption, or even complete system compromise. Attackers can exploit this vulnerability by crafting malicious applications that send oversized data payloads through the debugfs interface, which is typically accessible to privileged processes. The vulnerability's exploitation potential aligns with attack patterns described in the ATT&CK framework under privilege escalation and defense evasion techniques, as it allows for kernel-level memory corruption. According to CWE classification, this represents a classic stack buffer overflow vulnerability (CWE-121) that occurs due to insufficient bounds checking, making it susceptible to both local privilege escalation and remote code execution scenarios.
Mitigation strategies for this vulnerability require immediate kernel updates and patches from Qualcomm and device manufacturers to address the buffer overflow in the MSM Thermal driver. System administrators should disable unnecessary debugfs interfaces and implement proper input validation mechanisms at the application level to prevent oversized data submissions. The vulnerability's classification as a stack-based buffer overflow places it within the scope of defensive measures outlined in the STRIDE threat modeling framework, particularly addressing the privilege escalation and denial of service attack vectors. Organizations should also consider implementing runtime monitoring and anomaly detection systems to identify potential exploitation attempts through debugfs interface abuse. Device vendors must ensure proper firmware and kernel version management to prevent exploitation of this vulnerability, as it represents a persistent risk to system integrity and user data security.