CVE-2018-11268 in Snapdragon Automobile
Summary
by MITRE
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
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Analysis
by VulDB Data Team • 05/17/2023
The vulnerability identified as CVE-2018-11268 represents a critical buffer overflow flaw within the Snapdragon automotive, mobile, and wearable platforms. This issue specifically affects a wide range of Qualcomm chipsets including the MDM9206, MDM9607, MDM9635M, and numerous other models across the Snapdragon family. The vulnerability manifests during the parsing of Trivial File Transfer Protocol (TFTP) options, which is a fundamental network protocol used for transferring files in embedded systems and automotive applications. The flaw stems from inadequate input validation and memory management when processing TFTP option fields, creating a scenario where maliciously crafted TFTP packets could trigger unauthorized memory access patterns. This vulnerability directly maps to CWE-121, which describes stack-based buffer overflow conditions, and potentially CWE-122 for heap-based buffer overflows, both of which are classified as high-risk issues in software security.
The operational impact of this vulnerability extends significantly within automotive and mobile environments where these Snapdragon chipsets are extensively deployed. In automotive applications, the affected systems may include infotainment systems, telematics units, and vehicle communication modules that rely on TFTP for firmware updates and configuration management. The buffer overflow could potentially allow remote attackers to execute arbitrary code on affected devices, leading to complete system compromise. Attackers could exploit this vulnerability by sending malicious TFTP packets to devices using vulnerable chipsets, potentially gaining unauthorized access to vehicle systems, accessing sensitive data, or disrupting critical automotive functions. The attack surface is particularly concerning given that these chipsets are used in various automotive platforms where security and reliability are paramount. According to ATT&CK framework, this vulnerability could enable techniques such as T1059.007 for command and scripting interpreter and T1068 for exploit for privilege escalation, making it a significant concern for automotive cybersecurity.
Mitigation strategies for CVE-2018-11268 should focus on both immediate patching and network-level protections. Qualcomm has released security updates addressing this vulnerability, and system administrators must prioritize applying these patches to all affected devices. Network segmentation and firewall rules should be implemented to restrict TFTP traffic to only trusted sources, as TFTP operates on UDP port 69 and lacks authentication mechanisms. Implementing intrusion detection systems that monitor for anomalous TFTP traffic patterns can provide additional layers of defense. Device manufacturers should consider disabling TFTP functionality when not required, particularly in automotive environments where unnecessary network protocols increase attack surface. The vulnerability also highlights the importance of secure firmware update mechanisms and proper input validation in embedded systems, aligning with NIST SP 800-144 guidelines for embedded system security. Organizations should conduct comprehensive vulnerability assessments to identify all devices using affected Snapdragon chipsets and implement continuous monitoring for potential exploitation attempts. Regular security audits and penetration testing focused on automotive network protocols should be conducted to ensure comprehensive protection against similar vulnerabilities.