CVE-2019-2300 in Snapdragon Auto
Summary
by MITRE
Possible buffer overflow in WLAN handler due to lack of validation of destination buffer size before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8098, IPQ8074, MDM9206, MDM9207C, MDM9607, MSM8996, MSM8996AU, MSM8998, QCA6174A, QCA6574AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130
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Analysis
by VulDB Data Team • 03/06/2020
This vulnerability represents a critical buffer overflow condition within the wireless local area network handler component of Qualcomm's Snapdragon chipset family, affecting a broad range of automotive, mobile, and IoT devices. The flaw stems from insufficient validation of destination buffer sizes prior to data copying operations, creating a potential exploitation vector that could allow malicious actors to execute arbitrary code or cause system instability. The vulnerability impacts multiple generations of Qualcomm's mobile, automotive, and industrial chipsets including the APQ8009, APQ8017, APQ8053, APQ8096, APQ8098, IPQ8074, MDM9206, MDM9207C, MDM9607, MSM8996, MSM8996AU, MSM8998, QCA6174A, QCA6574AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, and SXR1130 platforms. The vulnerability is classified as a buffer overflow under CWE-121, which specifically addresses the condition where a program writes data past the end of a fixed-length buffer, and may also relate to CWE-787, which covers out-of-bounds writes to memory. The operational impact of this vulnerability extends across multiple threat vectors defined in the MITRE ATT&CK framework, particularly under T1059 for command and scripting interpreter and T1068 for exploit for privilege escalation. Attackers could potentially leverage this flaw to gain unauthorized access to systems, execute malicious code, or cause denial of service conditions that could affect vehicle operations, consumer electronics functionality, or industrial IoT device performance. The affected Snapdragon platforms represent a significant portion of the automotive infotainment systems, mobile devices, and industrial connectivity solutions, making this vulnerability particularly concerning from a cybersecurity perspective. The buffer overflow condition occurs in the WLAN handler code where insufficient bounds checking allows data to be copied into a destination buffer that is too small to accommodate the incoming data. This type of vulnerability is particularly dangerous in embedded systems environments where memory corruption can lead to complete system compromise, especially in automotive applications where safety-critical systems may be affected. The vulnerability affects both the wireless connectivity and networking capabilities of affected devices, potentially allowing attackers to manipulate wireless communication protocols or gain deeper system access. Organizations should prioritize patch management for all affected Snapdragon-based devices, particularly those in automotive, industrial, and consumer electronics sectors where the vulnerability could be exploited to compromise system integrity. The remediation approach should focus on implementing proper buffer size validation and bounds checking mechanisms within the WLAN handler code, ensuring that all data copying operations verify destination buffer capacity before proceeding with memory operations. Additionally, network segmentation and monitoring solutions should be implemented to detect potential exploitation attempts and maintain situational awareness of wireless network activities within affected environments.