CVE-2021-30341 in Snapdragon Auto
Summary
by MITRE • 06/14/2022
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
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Analysis
by VulDB Data Team • 06/15/2022
The vulnerability identified as CVE-2021-30341 represents a critical memory corruption issue affecting multiple Snapdragon product lines including automotive, compute, connectivity, consumer electronics, iot, and wearable devices. This flaw manifests in the improper validation of buffer sizes within DSM packet processing mechanisms, creating a pathway for adversaries to exploit memory corruption vulnerabilities across various hardware platforms. The vulnerability stems from inadequate input validation that fails to properly check the size of received data packets before processing them within the system's memory structures.
The technical implementation of this vulnerability involves the DSM (Data Service Module) packet handling functionality where incoming data packets are not adequately validated for their buffer dimensions. When a maliciously crafted packet is received, the system processes it without sufficient size verification, potentially leading to buffer overflows or underflows that corrupt adjacent memory regions. This memory corruption can result in arbitrary code execution, system crashes, or unauthorized access to sensitive system resources. The flaw exists at the protocol level where packet data is accepted and processed without proper boundary checks that would normally prevent such memory violations.
From an operational perspective, this vulnerability poses significant risks to connected devices across multiple industry sectors including automotive systems, industrial automation, consumer electronics, and wearable technology. Attackers could leverage this weakness to compromise device functionality, potentially gaining unauthorized access to vehicle systems, industrial control networks, or personal data stored on consumer devices. The widespread impact across multiple Snapdragon product categories means that organizations deploying these chips in critical infrastructure must consider the potential for cascading security failures throughout their connected ecosystems. The vulnerability's nature as a memory corruption issue aligns with common attack patterns documented in the attack tactics and techniques framework, particularly those involving privilege escalation and system compromise.
The mitigation strategies for CVE-2021-30341 should prioritize firmware and software updates from manufacturers, as these patches typically address the buffer validation logic and implement proper size checking mechanisms. Network segmentation and monitoring of DSM packet traffic can help detect anomalous behavior that might indicate exploitation attempts. Additionally, implementing runtime protection mechanisms such as stack canaries, address space layout randomization, and memory protection features can provide additional defense layers. Organizations should also conduct comprehensive risk assessments considering the specific deployment contexts of their Snapdragon-based devices, particularly in automotive and industrial environments where system reliability and security are paramount. The vulnerability demonstrates the importance of robust input validation practices and aligns with common security principles outlined in the CWE database under buffer overflow categories, emphasizing the critical need for proper memory management in embedded systems and IoT devices.