CVE-2020-11247 in Snapdragon Autoinfo

Summary

by MITRE • 04/07/2021

Out of bound memory read while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

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Analysis

by VulDB Data Team • 04/11/2021

This vulnerability represents a critical out-of-bounds memory read condition that occurs during data unpacking operations within various Qualcomm Snapdragon processor families. The flaw stems from insufficient validation of offset length parameters during data processing, creating a scenario where maliciously crafted input data can cause the system to access memory locations beyond the allocated buffer boundaries. This type of vulnerability falls under the CWE-129 category of Improper Validation of Array Index, specifically manifesting as an out-of-bounds read that can lead to information disclosure or system instability.

The affected Snapdragon product lines include automotive, compute, connectivity, consumer IoT, industrial IoT, mobile, voice and music, and wearable devices, indicating a widespread impact across Qualcomm's ecosystem. These processors are commonly found in smartphones, tablets, automotive systems, IoT devices, and wearable technology, making the vulnerability particularly concerning from a cybersecurity perspective. The vulnerability exists in the data unpacking routines where the system fails to properly validate the length of offsets before using them to access memory regions, allowing attackers to potentially manipulate these values to read arbitrary memory locations.

From an operational standpoint, this vulnerability presents significant risks to device security and stability. An attacker could potentially exploit this condition to read sensitive information from memory, including cryptographic keys, user credentials, or other confidential data stored in adjacent memory regions. The attack vector typically involves sending specially crafted data packets or payloads that trigger the vulnerable unpacking routine, causing the system to read beyond intended boundaries. This vulnerability aligns with ATT&CK technique T1059.007 for Command and Scripting Interpreter and T1566.001 for Phishing, as exploitation often occurs through malicious data injection during normal device operations.

The security implications extend beyond simple information disclosure, as this vulnerability can potentially enable more sophisticated attacks including privilege escalation or system compromise. The widespread presence of these processors across multiple device categories means that exploitation could affect a broad range of systems from consumer mobile devices to industrial IoT equipment. Organizations should prioritize patching and updating affected devices as soon as possible, particularly in environments where these devices handle sensitive data or operate in security-critical roles. The vulnerability demonstrates the importance of proper input validation and bounds checking in embedded systems, where memory safety issues can have cascading effects across entire device ecosystems.

Mitigation strategies should focus on implementing robust input validation mechanisms, deploying memory protection features such as stack canaries and address space layout randomization, and ensuring timely security updates are applied across all affected platforms. System administrators should also consider network segmentation and monitoring to detect potential exploitation attempts, while device manufacturers need to enhance their code review processes to identify similar vulnerabilities in other data processing routines. The vulnerability serves as a reminder of the critical importance of memory safety in embedded systems and the need for comprehensive security testing throughout the development lifecycle.

Responsible

Qualcomm, Inc.

Reservation

03/31/2020

Disclosure

04/07/2021

Moderation

accepted

CPE

ready

EPSS

0.00944

KEV

no

Activities

very low

Sources

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