Qualcomm Snapdragon Automobile up to SDX20 Sensor Registry Configuration File memory corruption
| CVSS Meta Temp Score | Current Exploit Price (≈) | CTI Interest Score |
|---|---|---|
| 6.7 | $0-$5k | 0.00 |
Summary
A vulnerability categorized as critical has been discovered in Qualcomm Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. The affected element is an unknown function of the component Sensor Registry Handler. The manipulation as part of Configuration File results in memory corruption. This vulnerability was named CVE-2017-18303. The attack needs to be approached locally. There is no available exploit. It is advisable to upgrade the affected component.
Details
A vulnerability, which was classified as critical, was found in Qualcomm Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear (Chip Software). Affected is an unknown functionality of the component Sensor Registry Handler. The manipulation as part of a Configuration File leads to a memory corruption vulnerability. CWE is classifying the issue as CWE-119. The product performs operations on a memory buffer, but it can read from or write to a memory location that is outside of the intended boundary of the buffer. This is going to have an impact on confidentiality, integrity, and availability. CVE summarizes:
While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20.
The bug was discovered 09/04/2018. The weakness was presented 10/23/2018 (Website). The advisory is shared for download at source.android.com. This vulnerability is traded as CVE-2017-18303 since 06/15/2018. The exploitability is told to be easy. The attack needs to be approached locally. The exploitation doesn't require any form of authentication. There are neither technical details nor an exploit publicly available.
The vulnerability was handled as a non-public zero-day exploit for at least 49 days. During that time the estimated underground price was around $5k-$25k.
Upgrading eliminates this vulnerability.
See VDB-124288, VDB-124289, VDB-124290 and VDB-125857 for similar entries. Once again VulDB remains the best source for vulnerability data.
Product
Type
Vendor
Name
Version
- MDM9607
- MDM9650
- MMDM9206
- MSM8909W
- MSM8996AU
- SD 210-SD 212-SD 205
- SD 425
- SD 430
- SD 450
- SD 600
- SD 615-16-SD 415
- SD 617
- SD 625
- SD 650-52
- SD 800
- SD 810
- SD 820
- SD 820A
- SD 835
- SDA660
- SDX20
License
Website
- Vendor: https://www.qualcomm.com/
CPE 2.3
CPE 2.2
CVSSv4
VulDB Vector: 🔍VulDB Reliability: 🔍
CVSSv3
VulDB Meta Base Score: 6.8VulDB Meta Temp Score: 6.7
VulDB Base Score: 5.9
VulDB Temp Score: 5.7
VulDB Vector: 🔍
VulDB Reliability: 🔍
NVD Base Score: 7.8
NVD Vector: 🔍
CVSSv2
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| Vector | Complexity | Authentication | Confidentiality | Integrity | Availability |
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VulDB Base Score: 🔍
VulDB Temp Score: 🔍
VulDB Reliability: 🔍
NVD Base Score: 🔍
Exploiting
Class: Memory corruptionCWE: CWE-119
CAPEC: 🔍
ATT&CK: 🔍
Physical: Partially
Local: Yes
Remote: No
Availability: 🔍
Status: Not defined
EPSS Score: 🔍
EPSS Percentile: 🔍
Price Prediction: 🔍
Current Price Estimation: 🔍
| 0-Day | Unlock | Unlock | Unlock | Unlock |
|---|---|---|---|---|
| Today | Unlock | Unlock | Unlock | Unlock |
Threat Intelligence
Interest: 🔍Active Actors: 🔍
Active APT Groups: 🔍
Countermeasures
Recommended: UpgradeStatus: 🔍
0-Day Time: 🔍
Timeline
06/15/2018 🔍09/04/2018 🔍
10/23/2018 🔍
10/23/2018 🔍
10/24/2018 🔍
05/30/2023 🔍
Sources
Vendor: qualcomm.comAdvisory: source.android.com
Status: Not defined
Confirmation: 🔍
CVE: CVE-2017-18303 (🔍)
GCVE (CVE): GCVE-0-2017-18303
GCVE (VulDB): GCVE-100-125868
SecurityTracker: 1041432
See also: 🔍
Entry
Created: 10/24/2018 06:56Updated: 05/30/2023 16:21
Changes: 10/24/2018 06:56 (60), 05/03/2020 16:30 (2), 05/30/2023 16:21 (4)
Complete: 🔍
Cache ID: 216::103
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