AMD EPYC Processors SMM Module heap-based overflow

CVSS Meta Temp Score
CVSS is a standardized scoring system to determine possibilities of attacks. The Temp Score considers temporal factors like disclosure, exploit and countermeasures. The unique Meta Score calculates the average score of different sources to provide a normalized scoring system.
Current Exploit Price (≈)
Our analysts are monitoring exploit markets and are in contact with vulnerability brokers. The range indicates the observed or calculated exploit price to be seen on exploit markets. A good indicator to understand the monetary effort required for and the popularity of an attack.
CTI Interest Score
Our Cyber Threat Intelligence team is monitoring different web sites, mailing lists, exploit markets and social media networks. The CTI Interest Score identifies the interest of attackers and the security community for this specific vulnerability in real-time. A high score indicates an elevated risk to be targeted for this vulnerability.
8.1$0-$5k0.00

Summaryinfo

A vulnerability categorized as very critical has been discovered in AMD EPYC Processors, Instinct MI300A Processors, Ryzen Processors and Athlon Processors. The affected element is an unknown function of the component SMM Module. Such manipulation leads to heap-based overflow. This vulnerability is traded as CVE-2023-20577. An attack has to be approached locally. There is no exploit available.

Detailsinfo

A vulnerability was found in AMD EPYC Processors, Instinct MI300A Processors, Ryzen Processors and Athlon Processors (affected version unknown). It has been rated as very critical. Affected by this issue is an unknown functionality of the component SMM Module. The manipulation with an unknown input leads to a heap-based overflow vulnerability. Using CWE to declare the problem leads to CWE-122. A heap overflow condition is a buffer overflow, where the buffer that can be overwritten is allocated in the heap portion of memory, generally meaning that the buffer was allocated using a routine such as malloc(). Impacted is confidentiality, integrity, and availability. CVE summarizes:

A heap overflow in SMM module may allow an attacker with access to a second vulnerability that enables writing to SPI flash, potentially resulting in arbitrary code execution.

The advisory is available at amd.com. This vulnerability is handled as CVE-2023-20577 since 10/27/2022. The exploitation is known to be easy. Local access is required to approach this attack. The technical details are unknown and an exploit is not available. The structure of the vulnerability defines a possible price range of USD $0-$5k at the moment (estimation calculated on 09/02/2026).

There is no information about possible countermeasures known. It may be suggested to replace the affected object with an alternative product.

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Productinfo

Vendor

Name

License

CPE 2.3info

CPE 2.2info

CVSSv4info

VulDB Vector: 🔒
VulDB Reliability: 🔍

CVSSv3info

VulDB Meta Base Score: 8.1
VulDB Meta Temp Score: 8.1

VulDB Base Score: 8.8
VulDB Temp Score: 8.8
VulDB Vector: 🔒
VulDB Reliability: 🔍

CNA Base Score: 7.4
CNA Vector (AMD): 🔒

CVSSv2info

AVACAuCIA
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VectorComplexityAuthenticationConfidentialityIntegrityAvailability
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VulDB Base Score: 🔒
VulDB Temp Score: 🔒
VulDB Reliability: 🔍

Exploitinginfo

Class: Heap-based overflow
CWE: CWE-122 / CWE-119
CAPEC: 🔒
ATT&CK: 🔒

Physical: Partially
Local: Yes
Remote: No

Availability: 🔒
Status: Not defined

EPSS Score: 🔒
EPSS Percentile: 🔒

Price Prediction: 🔍
Current Price Estimation: 🔒

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Threat Intelligenceinfo

Interest: 🔍
Active Actors: 🔍
Active APT Groups: 🔍

Countermeasuresinfo

Recommended: no mitigation known
Status: 🔍

0-Day Time: 🔒

Timelineinfo

10/27/2022 CVE reserved
09/02/2026 +1406 days Advisory disclosed
09/02/2026 +0 days VulDB entry created
09/02/2026 +0 days VulDB entry last update

Sourcesinfo

Advisory: amd.com
Status: Confirmed

CVE: CVE-2023-20577 (🔒)
GCVE (CVE): GCVE-0-2023-20577
GCVE (VulDB): GCVE-100-398294

Entryinfo

Created: 09/02/2026 22:09
Changes: 09/02/2026 22:09 (60)
Complete: 🔍
Cache ID: 216::103

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